Huawei has already confirmed that its new P40 series phones will be unveiled next March in Paris, France, revealing that we’re in for a never-before-seen design for the new handset. That’s a wild claim considering that you can’t really do much more with phone design nowadays. Foldable phones are already a thing, and the first prototypes of devices that feature in-display cameras were revealed months ago — the latter is the holy grail we need for perfect all-screen designs. Huawei didn’t explain what design novelties it has in mind for the upcoming P40 series, but the phone seemingly just leaked and we might have an answer for you.
From the looks of the following renders that come via the same @OnLeaks and 91Mobiles partnership that gave us other mobile leaks recently, Huawei intends to curve the P40’s screen on all four sides.
At least the P40 Pro flagship version will apparently feature four curved edges on the display. As a result, the corners of the phone will stand out because they’ll be notched, as seen in the following image.
The P40 Pro is expected to feature a glass sandwich design — that’s a metal frame situated between two sheets of glass, one on the front covering the display, and one on the back. The display design makes sense considering other reports claimed this might be the next evolution in smartphone screen design. However, it’s unclear how Huawei will handle the selfie camera.
Curving the top and bottom edges of the screen will help smartphone makers kill the top and bottom bezels, which is the primary purpose of the lateral screen edges. But placing any sort of notch at the top might ruin the design. The report says the phones will feature 2mm holes at the top edge, without explaining the role of the holes. We might be looking at a hole-punch camera, the likes of which we’ve seen on Samsung and Huawei phones this year, with the Galaxy S10 and Note 10 being popular devices that sport such screen designs. A hole-punch camera would definitely work better with a curved edge at the top than a notch.
The phones will also feature in-display fingerprint sensors, according to 91 mobiles.
These renders aren’t enough to clarify what will happen to the selfie camera, but they do suggest the P40 phones will have large rectangular camera modules on the back. The regular P40 might sport four rear cameras, with the Pro getting as many as five lenses on the back.
The report mentions some of the specs of the P40 series, saying the regular model will feature a 6.1-inch or 6.2-inch flat display, while the P40 Pro is getting the unique design above with the screen measuring 6.5 inches or 6.7 inches. The phones will have USB-C connectivity on the bottom, but there’s no 3.5mm audio jack in the cards for the P40 series.
Shortage of microchips is shortcutting mobile phone manufacturing – Global Times
The Kunpeng 920 chip, among other server chips, showcased at Huawei Beijing research center. Photo:CGTN
A global microchip shortage is plaguing the entire cell phone manufacturing, as well as hitting personal computer making and car production.
The shortage is spurred by COVID-19-induced supply crunch, the fallout from US’ trade war and a fierce arms race, according to mobile phone manufacturers and experts, and the chip shortfall is likely to last for months.
A growing chorus of mobile phone vendors warned in recent weeks they cannot access enough chips to make their products.
“The chips and other components from Qualcomm are out of stock, including power supply and RF devices,” a person with Chinese smartphone maker Realme said on Monday.
“There’s a shortage of microchips this year. It’s not just shortfall but severe shortage,” Lu Weibing, vice president of Xiaomi group said on his Weibo account on Feb 24.
Jiang Xiaofeng, sales director of Umidigi, a Chinese mobile phone company, told Global Times on Monday that the whole industry is facing challenges including increasing prices of raw materials and even running out of stock.
“Due to the influence of COVID-19, the cost of mobile phone manufacturing industry is rising rapidly.” said Jiang.
Jiang noted that the price of semiconductor chips keeps rising, which affect their manufacturing directly, and the production cost may not go down in a short time.
Key industrial players like Qualcomm, have noted the shortage. “The shortage in the semiconductor industry is across the board,” said incoming Qualcomm CEO Cristiano Amon in January, CNBC reported.
The delivery time of the whole series of materials for Qualcomm has been extended to more than 30 weeks, and the delivery time of CSR Bluetooth audio chips to 33 weeks, Yicai reported, citing person in the mobile industrial chain.
Some chip makers which cannot resume normal production because of the US sanction measures, such as SMIC, also exacerbated the market shortage, Xiang Ligang, director-general of the Beijing-based Information Consumption Alliance, told the Global Times on Monday.
As a result major smartphone makers have begun hoarding components which helped accelerate the market shortage, Xiang added.
Umidigi, for example, had prepared a batch of smart phone chips in advance, according to Jiang. “We usually pre-stock materials for our manufacturing capacity in advance of three to six months based on our plans,” said Jiang.
He said the current chips for the company can meet the requirement of daily manufacturing capacity and company’s stocked chips can be used until the end of the second quarter of 2021.
Other mobile phone manufacturers including Huawei, Oppo, vivo are also reported to increase stocking components.
Experts predicted that chips are likely to remain in short supply over the coming months as demand remains higher than ever.
According to the Semiconductor Industry Association, global chip sales would grow 8.4 percent in 2021 from 2020′s total of $433 billion, up from 5.1 percent year-on-year.
Xiang estimates there will be a short-term price hike up due to the uneven supply and demand, but the shortage would be eased by the second half of the year. “As far as I know chip manufacturers are increasing their production capacity and China’s accelerated speed in the construction of chip foundries is also expected to ease the shortage,” he said.
Xiao Yaqing, Minister of the Ministry of industry and information technology, told a briefing on Monday that China will provide necessary support at the national level to build a market-oriented semiconductor industry.
“We will increase tax cuts for IC enterprises and further enhance the basic foundation of the industry including raw materials, technology and equipment,” Xiao said.
Xiaomi Redmi Note 10 major leak reveals design, Snadragon 678 chipset – GSMArena.com news – GSMArena.com
Xiaomi will announce its Redmi Note 10 lineup on March 4 but the phone keeps leaking all over the palce. After we saw its box and back panel, now we get to learn more about the phone itself, including screen, charging, and chipset.
The Redmi Note 10 will be powered by a Snapdragon 678 – a slightly enhanced SD675, built on the 11nm LLP process. It will have an overclocked main CPU dual-core cluster at 2.2 GHz, while a 5,000 mAh battery will keep the lights on.
The battery is a ever so sslightly smaller than the Redmi Note 9’s (which had a 5,020 mAh power cell) but will bring 33W fast charging, becoming the first non-Pro Redmi Note to have such high rates.
The image also reveals a 6.43” Super AMOLED screen with a single punch hole for the selfie camera in the middle. This Redmi Note 10 will also have dual speakers, which is hardly any surprise – there’ll be a dedicated one on the bottom, while the earpiece on top will act as the other channel.
Vivo S9 5G confirmed to feature Dimensity 1100 and UFS 3.1 – gizmochina
Today, Vivo rolled a promo video of the Vivo S9 5G smartphone that is slated to launch on March 3 in China. The design of the Vivo S9 5G was revealed last week through its official renders. Today’s promo video teases the handset in real and confirms some of its key features.
The short video reveals that the Vivo S9 5G has a wider notch on the display like the predecessor Vivo S7 5G smartphone. The notch houses a dual selfie camera system. The company confirmed last week that it includes a 44-megapixel lens as the primary selfie camera.
The backside of the Vivo S9 5G has a rectangle-shaped module for its triple camera system. Leaks have claimed that it includes a 64-megapixel main camera. The promo video confirms that the Vivo S9 5G is powered by the Dimensity 1100 chipset and UFS 3.1 storage.
Speaking of Dimensity 1100, the handset has appeared with the chipset and 12 GB of RAM on Geekbench. The handset can be seen running on Android 11 OS. In the single-core test, the handset scored 860 points and it recorded a score of 3532 in the multi-core test.
Other leaks have revealed that the Vivo S9 5G will sport an AMOLED screen that offers a 90Hz refresh rate. The device could be housing a 4,100mAh battery that supports 33W fast charging.
The Vivo S9e 5G is also going to launch with Vivo S9 5G on Wednesday. The company has confirmed that the device will sport a 32-megapixel selfie camera. Past reports have revealed that the Vivo S9e has specs like Dimensity 820 chipset, 8 GB of RAM, and a 4,100mAh battery with 33W fast charging.
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